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SolidMatrix Fast Acting Chip Fuse 2004



SolidMatrix® Lead-Free 1206 Fast Acting Surface Mount Fuses

Features:

Multilayer monolithic structure with glass ceramic body and silver
fusing element
Silver termination with nickel and pure-tin solder plating, providing
excellent solderability
Compatible with both wave and reflow soldering processes
Operating temperature range: -55oC to +125oC (with de-rating)
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SolidMatrix Fast Acting Chip Fuse Cross-Reference

SolidMatrix_Fast_Acting_Chip_Fuse_Cross-Reference.pdf   104 K

SolidMatrix Slow Blow Chip Fuse 2004



SolidMatrix® Lead-Free 1206 Slow Blow Surface Mount Fuses

Features:

High inrush current withstanding capability
Ceramic monolithic structure
Sliver fusing element and silver termination with nickel and tin plating
Lead-free materials
Symmetrical design with marking on both sides (optional)
Operating temperature range: -55°C + 125°C (with de-rating)

SolidMatrix Slow Blow Chip Fuse Cross-Reference

SolidMatrix_Slow_Blow_Cross-Reference.pdf   78 K

AEM Inductors and Ferrite Chip Beads Catalog.

AEM_Catalog_2004.pdf   5.3 M

 

 

 
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